Parametric study of sputtering microchannels via focused ion beam (FIB)

Focused ion beams (FIB) are used in microfabrication and have certain advantages compared to photolithography and other micromachining technologies. The main advantage is that it can be used for direct writing/patterning of the target material. FIB can create a variety of geometric features, has the...

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Main Authors:	Mohd Shahar, Siti Fatimah, Jaafar, Israd Hakim, Ali, Mohammad Yeakub
Format:	Article
Language:	English English
Published:	Asian Research Publishing Network (ARPN) 2015
Subjects:	TS Manufactures
Online Access:	http://irep.iium.edu.my/50752/ http://irep.iium.edu.my/50752/ http://irep.iium.edu.my/50752/1/50752_Parametric_study_of_sputtering_microchannels_via_focused_ion_beam_%28FIB%29.pdf http://irep.iium.edu.my/50752/2/50752_Parametric_study_of_sputtering_microchannels_via_focused_ion_beam_%28FIB%29_SCOPUS.pdf

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recordtype	eprints
spelling	iium-507522016-12-05T08:19:18Z http://irep.iium.edu.my/50752/ Parametric study of sputtering microchannels via focused ion beam (FIB) Mohd Shahar, Siti Fatimah Jaafar, Israd Hakim Ali, Mohammad Yeakub TS Manufactures Focused ion beams (FIB) are used in microfabrication and have certain advantages compared to photolithography and other micromachining technologies. The main advantage is that it can be used for direct writing/patterning of the target material. FIB can create a variety of geometric features, has the ability to process without masks, and can accommodate the patterning of a variety of materials. In high aspect micromilling, the beam current, beam diameter as well as the dwell time are some of the parameters that need to be taken into account. In this research, different beam currents with respective beam diameters were used to investigate the optimum parameters that can be achieved in milling microchannels. The target material that was used in this experiment was Silicon < 100 >. The wafer used had 250 μm thicknesses. The results observed were the channel width, gap between the channels, and the channel depth. The main trend observed was that when the beam current increases, the depth and the channels' width also increase whereas the channels' gap decreases. Defects such as side wall tapering effect and swelling were noticed from the experiments that used the unsuitable parameters because the values of beam current are not enough to sputter the silicon surface. The best beam current use that give the nearest result to the actual pattern is around 7.0-8.0 pA. Extended research need to be conducted to see the effect on the surface roughness of the channels. Asian Research Publishing Network (ARPN) 2015-12 Article PeerReviewed application/pdf en http://irep.iium.edu.my/50752/1/50752_Parametric_study_of_sputtering_microchannels_via_focused_ion_beam_%28FIB%29.pdf application/pdf en http://irep.iium.edu.my/50752/2/50752_Parametric_study_of_sputtering_microchannels_via_focused_ion_beam_%28FIB%29_SCOPUS.pdf Mohd Shahar, Siti Fatimah and Jaafar, Israd Hakim and Ali, Mohammad Yeakub (2015) Parametric study of sputtering microchannels via focused ion beam (FIB). ARPN Journal of Engineering and Applied Sciences, 10 (23). pp. 17397-17401. ISSN 1819-6608 http://www.arpnjournals.org/jeas/research_papers/rp_2015/jeas_1215_3183.pdf
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English English
topic	TS Manufactures
spellingShingle	TS Manufactures Mohd Shahar, Siti Fatimah Jaafar, Israd Hakim Ali, Mohammad Yeakub Parametric study of sputtering microchannels via focused ion beam (FIB)
description	Focused ion beams (FIB) are used in microfabrication and have certain advantages compared to photolithography and other micromachining technologies. The main advantage is that it can be used for direct writing/patterning of the target material. FIB can create a variety of geometric features, has the ability to process without masks, and can accommodate the patterning of a variety of materials. In high aspect micromilling, the beam current, beam diameter as well as the dwell time are some of the parameters that need to be taken into account. In this research, different beam currents with respective beam diameters were used to investigate the optimum parameters that can be achieved in milling microchannels. The target material that was used in this experiment was Silicon < 100 >. The wafer used had 250 μm thicknesses. The results observed were the channel width, gap between the channels, and the channel depth. The main trend observed was that when the beam current increases, the depth and the channels' width also increase whereas the channels' gap decreases. Defects such as side wall tapering effect and swelling were noticed from the experiments that used the unsuitable parameters because the values of beam current are not enough to sputter the silicon surface. The best beam current use that give the nearest result to the actual pattern is around 7.0-8.0 pA. Extended research need to be conducted to see the effect on the surface roughness of the channels.
format	Article
author	Mohd Shahar, Siti Fatimah Jaafar, Israd Hakim Ali, Mohammad Yeakub
author_facet	Mohd Shahar, Siti Fatimah Jaafar, Israd Hakim Ali, Mohammad Yeakub
author_sort	Mohd Shahar, Siti Fatimah
title	Parametric study of sputtering microchannels via focused ion beam (FIB)
title_short	Parametric study of sputtering microchannels via focused ion beam (FIB)
title_full	Parametric study of sputtering microchannels via focused ion beam (FIB)
title_fullStr	Parametric study of sputtering microchannels via focused ion beam (FIB)
title_full_unstemmed	Parametric study of sputtering microchannels via focused ion beam (FIB)
title_sort	parametric study of sputtering microchannels via focused ion beam (fib)
publisher	Asian Research Publishing Network (ARPN)
publishDate	2015
url	http://irep.iium.edu.my/50752/ http://irep.iium.edu.my/50752/ http://irep.iium.edu.my/50752/1/50752_Parametric_study_of_sputtering_microchannels_via_focused_ion_beam_%28FIB%29.pdf http://irep.iium.edu.my/50752/2/50752_Parametric_study_of_sputtering_microchannels_via_focused_ion_beam_%28FIB%29_SCOPUS.pdf
first_indexed	2023-09-18T21:11:48Z
last_indexed	2023-09-18T21:11:48Z
_version_	1777411301607211008

Parametric study of sputtering microchannels via focused ion beam (FIB)

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