Low temperature solder alloys for ultrasonic soldering of glass

The research focused on improving the adhesion of low melting temperature lead free solders to soda lime glass through ultrasonic soldering. All soldering parameters involving temperature, time, vibration amplitude and frequency were kept constant except for the new alloying elements to Sn40Bi sold...

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Main Authors:	Mustafa, Yusri, Hilmy, Irfan, Adesta, Erry Yulian Triblas
Format:	Article
Language:	English
Published:	Asian Research Publishing Network (ARPN) 2015
Subjects:	TS Manufactures
Online Access:	http://irep.iium.edu.my/49954/ http://irep.iium.edu.my/49954/ http://irep.iium.edu.my/49954/1/jeas_1115_2972.pdf

id	iium-49954
recordtype	eprints
spelling	iium-499542016-05-11T04:47:22Z http://irep.iium.edu.my/49954/ Low temperature solder alloys for ultrasonic soldering of glass Mustafa, Yusri Hilmy, Irfan Adesta, Erry Yulian Triblas TS Manufactures The research focused on improving the adhesion of low melting temperature lead free solders to soda lime glass through ultrasonic soldering. All soldering parameters involving temperature, time, vibration amplitude and frequency were kept constant except for the new alloying elements to Sn40Bi solders. Improvement on adhesion strength of Sn40Bi solders was attempted by alloying with Al, Mg, Zn and Ag elements. Tensile test was applied on soldered specimen to determine shear separation strength. The positive effect of metal oxide passivation from alloying elements was observed on the adhesion strength. Tensile test and thermogravimetry analysis were applied to determine mechanical and chemical properties of selected solder alloys (Sn40Bi) 0.3 Mg and (Sn40Bi) 0.5Al. Scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX) were used to examine the bonding mechanism of the selected solders to glass. Sn and Bi were observed to remain in metallic form without adhering to glass. Mg and Al were observed to passivate to metal oxide form. MgO from (Sn40Bi) 0.3 Mg forms metal oxide bond to glass. Al2O3 from (Sn40Bi) 0.5Al forms metal oxide bond to glass. Asian Research Publishing Network (ARPN) 2015-11 Article PeerReviewed application/pdf en http://irep.iium.edu.my/49954/1/jeas_1115_2972.pdf Mustafa, Yusri and Hilmy, Irfan and Adesta, Erry Yulian Triblas (2015) Low temperature solder alloys for ultrasonic soldering of glass. ARPN Journal of Engineering and Applied Sciences, 10 (21). pp. 9717-9722. ISSN 1819-6608 http://www.arpnjournals.com/jeas/volume_21_2015.htm
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TS Manufactures
spellingShingle	TS Manufactures Mustafa, Yusri Hilmy, Irfan Adesta, Erry Yulian Triblas Low temperature solder alloys for ultrasonic soldering of glass
description	The research focused on improving the adhesion of low melting temperature lead free solders to soda lime glass through ultrasonic soldering. All soldering parameters involving temperature, time, vibration amplitude and frequency were kept constant except for the new alloying elements to Sn40Bi solders. Improvement on adhesion strength of Sn40Bi solders was attempted by alloying with Al, Mg, Zn and Ag elements. Tensile test was applied on soldered specimen to determine shear separation strength. The positive effect of metal oxide passivation from alloying elements was observed on the adhesion strength. Tensile test and thermogravimetry analysis were applied to determine mechanical and chemical properties of selected solder alloys (Sn40Bi) 0.3 Mg and (Sn40Bi) 0.5Al. Scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX) were used to examine the bonding mechanism of the selected solders to glass. Sn and Bi were observed to remain in metallic form without adhering to glass. Mg and Al were observed to passivate to metal oxide form. MgO from (Sn40Bi) 0.3 Mg forms metal oxide bond to glass. Al2O3 from (Sn40Bi) 0.5Al forms metal oxide bond to glass.
format	Article
author	Mustafa, Yusri Hilmy, Irfan Adesta, Erry Yulian Triblas
author_facet	Mustafa, Yusri Hilmy, Irfan Adesta, Erry Yulian Triblas
author_sort	Mustafa, Yusri
title	Low temperature solder alloys for ultrasonic soldering of glass
title_short	Low temperature solder alloys for ultrasonic soldering of glass
title_full	Low temperature solder alloys for ultrasonic soldering of glass
title_fullStr	Low temperature solder alloys for ultrasonic soldering of glass
title_full_unstemmed	Low temperature solder alloys for ultrasonic soldering of glass
title_sort	low temperature solder alloys for ultrasonic soldering of glass
publisher	Asian Research Publishing Network (ARPN)
publishDate	2015
url	http://irep.iium.edu.my/49954/ http://irep.iium.edu.my/49954/ http://irep.iium.edu.my/49954/1/jeas_1115_2972.pdf
first_indexed	2023-09-18T21:10:35Z
last_indexed	2023-09-18T21:10:35Z
_version_	1777411226034241536

Low temperature solder alloys for ultrasonic soldering of glass

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