Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating

Wire electro-discharges machining (WEDM) is a variant of electro-discharge machining (EDM) based method for non-contact machining that uses wire as the machining tool. Micro-EDMing/micro-WEDMing (where discharge energy is very low and tool size in micrometer range) operation of silicon (Si) can...

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Main Authors:	Saleh, Tanveer, Rasheed, Aous Naji, Abdul Muthalif, Asan Gani
Format:	Article
Language:	English English
Published:	Springer 2015
Subjects:	T Technology (General)
Online Access:	http://irep.iium.edu.my/43003/ http://irep.iium.edu.my/43003/ http://irep.iium.edu.my/43003/ http://irep.iium.edu.my/43003/1/IJAMT_published_printed.pdf http://irep.iium.edu.my/43003/2/Proof_ISI.pdf

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spelling	iium-430032018-05-21T06:24:24Z http://irep.iium.edu.my/43003/ Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating Saleh, Tanveer Rasheed, Aous Naji Abdul Muthalif, Asan Gani T Technology (General) Wire electro-discharges machining (WEDM) is a variant of electro-discharge machining (EDM) based method for non-contact machining that uses wire as the machining tool. Micro-EDMing/micro-WEDMing (where discharge energy is very low and tool size in micrometer range) operation of silicon (Si) can achieve features with very complex shapes, which have many useful applications in microelectro-mechanical system (MEMS). However, Si is a semiconductor material with high resistivity, and it is difficult to create electrical sparks during μ- WEDM/μ-EDM process. Thus, the machining of Si can be enhanced if it is possible to increase the conductivity of this semiconductor. This study aims to develop and characterize the process of improved μ-WEDM and μ-EDM of Si by temporarily coating Si with a high conductive metal (gold in this study). Micro-WEDM process stability was found to be improved (~100× for different machining condition) if coated Si wafer is used as compared to uncoated Si workpiece. Material removal rate (MRR) was also found to be increased by a good margin (~30 % average) for coated Si wafer. Machined slots were found to be more uniform though kerf width was slightly larger for coated Si wafer. In case of μ-EDM operation, goldcoated Si also enhanced the machining as compared to uncoated Si. In this case, MRR was increased by up to seven times for coated samples. Overall, this new method of μ-WEDM and μ- EDM technique of polished Si wafer has been found to be more efficient and useful. Removal of the conductive coating without damaging the substrate is a challenge for this process, which was carried out successfully by selective etching method. Springer 2015 Article PeerReviewed application/pdf en http://irep.iium.edu.my/43003/1/IJAMT_published_printed.pdf application/pdf en http://irep.iium.edu.my/43003/2/Proof_ISI.pdf Saleh, Tanveer and Rasheed, Aous Naji and Abdul Muthalif, Asan Gani (2015) Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating. International Journal of Advanced Manufacturing Technology, 78. pp. 1651-1663. ISSN 1433-3015 (O); 0268-3768 (P) http://link.springer.com/article/10.1007/s00170-014-6732-4 DOI 10.1007/s00170-014-6732-4
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English English
topic	T Technology (General)
spellingShingle	T Technology (General) Saleh, Tanveer Rasheed, Aous Naji Abdul Muthalif, Asan Gani Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating
description	Wire electro-discharges machining (WEDM) is a variant of electro-discharge machining (EDM) based method for non-contact machining that uses wire as the machining tool. Micro-EDMing/micro-WEDMing (where discharge energy is very low and tool size in micrometer range) operation of silicon (Si) can achieve features with very complex shapes, which have many useful applications in microelectro-mechanical system (MEMS). However, Si is a semiconductor material with high resistivity, and it is difficult to create electrical sparks during μ- WEDM/μ-EDM process. Thus, the machining of Si can be enhanced if it is possible to increase the conductivity of this semiconductor. This study aims to develop and characterize the process of improved μ-WEDM and μ-EDM of Si by temporarily coating Si with a high conductive metal (gold in this study). Micro-WEDM process stability was found to be improved (~100× for different machining condition) if coated Si wafer is used as compared to uncoated Si workpiece. Material removal rate (MRR) was also found to be increased by a good margin (~30 % average) for coated Si wafer. Machined slots were found to be more uniform though kerf width was slightly larger for coated Si wafer. In case of μ-EDM operation, goldcoated Si also enhanced the machining as compared to uncoated Si. In this case, MRR was increased by up to seven times for coated samples. Overall, this new method of μ-WEDM and μ- EDM technique of polished Si wafer has been found to be more efficient and useful. Removal of the conductive coating without damaging the substrate is a challenge for this process, which was carried out successfully by selective etching method.
format	Article
author	Saleh, Tanveer Rasheed, Aous Naji Abdul Muthalif, Asan Gani
author_facet	Saleh, Tanveer Rasheed, Aous Naji Abdul Muthalif, Asan Gani
author_sort	Saleh, Tanveer
title	Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating
title_short	Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating
title_full	Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating
title_fullStr	Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating
title_full_unstemmed	Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating
title_sort	experimental study on improving μ- wedm and μ-edm of doped silicon by temporary metallic coating
publisher	Springer
publishDate	2015
url	http://irep.iium.edu.my/43003/ http://irep.iium.edu.my/43003/ http://irep.iium.edu.my/43003/ http://irep.iium.edu.my/43003/1/IJAMT_published_printed.pdf http://irep.iium.edu.my/43003/2/Proof_ISI.pdf
first_indexed	2023-09-18T21:01:16Z
last_indexed	2023-09-18T21:01:16Z
_version_	1777410639272083456

Experimental study on improving μ- WEDM and μ-EDM of doped silicon by temporary metallic coating

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