Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-...

Full description

Bibliographic Details
Main Authors:	Shaffiar, Norhashimah, Loh, W.K., Kamsah, N.
Format:	Conference or Workshop Item
Language:	English
Published:	2010
Subjects:	TA349 Mechanics of engineering. Applied mechanics
Online Access:	http://irep.iium.edu.my/39333/ http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf

id	iium-39333
recordtype	eprints
spelling	iium-393332015-01-08T09:39:24Z http://irep.iium.edu.my/39333/ Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package Shaffiar, Norhashimah Loh, W.K. Kamsah, N. TA349 Mechanics of engineering. Applied mechanics This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-dependent response of the solder is represented by Anand model. Progressive damage in the solder joint is described using continuum damage model. Results show that the critical solder joint is the one located at the corner of the BGA package. In this critical solder joint, both high stress and inelastic strain are localized in a small edge region at the solder/IMC interface at the board side of the assembly. The different inelastic strain rates experienced by the critical solder joint during fatigue cycles correspond to the distinct damage initiation stage, crack propagation stage and the final fast fracture of the solder joint. Damage initiation life covers nearly half of the total fatigue lives of the critical solder. 2010 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. (2010) Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package. In: 34th International Electronics Manufacturing Technology Conference (IEMT 2010), 30th - 2nd November 2010 , Melaka.
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA349 Mechanics of engineering. Applied mechanics
spellingShingle	TA349 Mechanics of engineering. Applied mechanics Shaffiar, Norhashimah Loh, W.K. Kamsah, N. Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
description	This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-dependent response of the solder is represented by Anand model. Progressive damage in the solder joint is described using continuum damage model. Results show that the critical solder joint is the one located at the corner of the BGA package. In this critical solder joint, both high stress and inelastic strain are localized in a small edge region at the solder/IMC interface at the board side of the assembly. The different inelastic strain rates experienced by the critical solder joint during fatigue cycles correspond to the distinct damage initiation stage, crack propagation stage and the final fast fracture of the solder joint. Damage initiation life covers nearly half of the total fatigue lives of the critical solder.
format	Conference or Workshop Item
author	Shaffiar, Norhashimah Loh, W.K. Kamsah, N.
author_facet	Shaffiar, Norhashimah Loh, W.K. Kamsah, N.
author_sort	Shaffiar, Norhashimah
title	Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
title_short	Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
title_full	Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
title_fullStr	Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
title_full_unstemmed	Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
title_sort	progressive damage in sn-4ag-0.5cu solder joints during flexural fatigue of a bga package
publishDate	2010
url	http://irep.iium.edu.my/39333/ http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf
first_indexed	2023-09-18T20:56:30Z
last_indexed	2023-09-18T20:56:30Z
_version_	1777410339444359168

Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

Similar Items