Solder joint reliability assessment: finite element simulation methodology
Main Authors: | Tamin, M.N., Shaffiar, Norhashimah |
---|---|
Format: | Book |
Language: | English |
Published: |
Springer International Publishing
2014
|
Subjects: | |
Online Access: | http://irep.iium.edu.my/39072/ http://irep.iium.edu.my/39072/ http://irep.iium.edu.my/39072/1/Soldier_Joint_Reliability.pdf |
Similar Items
-
Fatigue fracture process of lead-free solder joints in BGA package
by: Tamin, M.N., et al.
Published: (2012) -
Continuum damage evolution in pb-free solder joint under shear fatigue loadings
by: Shaffiar, Norhashimah, et al.
Published: (2010) -
Damage progression in BGA solder joints during board-level drop test
by: Yamin, A.F.M., et al.
Published: (2011) -
Damage mechanics model for solder/intermetallics interface fracture process in solder joints
by: Shaffiar, Norhashimah, et al.
Published: (2011) -
Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
by: Shaffiar, Norhashimah, et al.
Published: (2010)