Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Per...

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Main Authors:	Yamin, A.F.M., Shaffiar, N.M., Loh, W.K., Tamin, M.N.
Format:	Conference or Workshop Item
Language:	English
Published:	2012
Subjects:	T Technology (General)
Online Access:	http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/1/IEMT_2012.pdf

id	iium-39051
recordtype	eprints
spelling	iium-390512015-01-08T02:28:07Z http://irep.iium.edu.my/39051/ Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N. T Technology (General) The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Performance of the extended CZM is examined using finite element (FE) simulation of a single Sn-4Ag-0.5Cu (SAC405) solder interconnect specimen. Strain ratedependent response of the solder is represented by unified inelastic strain equations (Anand’s model) with optimized model parameters for SAC405 solders. The 3D FE model of the specimen is subjected to cyclic relative displacement (Δδ = 0.003 mm, R = 0) so as to induce shear-dominant fatigue loading. Results show that interface crack initiated at the leading edge of the solder/IMC interface on the tool side of the assembly after 22 cycles have elapsed. Bending stress component induced by the solder stand-off height dominates the interface damage process. A straight interface crack front is predicted indicating the relatively brittle nature of the SAC405/Cu6Sn5 interface. The extended formulation of the CZM to account for load reversals has demonstrated the ability to describe the progressive solder/IMC interface damage process consistent with the mechanics of relatively brittle interface fracture. 2012-11 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/39051/1/IEMT_2012.pdf Yamin, A.F.M. and Shaffiar, N.M. and Loh, W.K. and Tamin, M.N. (2012) Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 6th-8th Nov 2012, Ipoh, Perak. http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6521786
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	T Technology (General)
spellingShingle	T Technology (General) Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N. Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
description	The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Performance of the extended CZM is examined using finite element (FE) simulation of a single Sn-4Ag-0.5Cu (SAC405) solder interconnect specimen. Strain ratedependent response of the solder is represented by unified inelastic strain equations (Anand’s model) with optimized model parameters for SAC405 solders. The 3D FE model of the specimen is subjected to cyclic relative displacement (Δδ = 0.003 mm, R = 0) so as to induce shear-dominant fatigue loading. Results show that interface crack initiated at the leading edge of the solder/IMC interface on the tool side of the assembly after 22 cycles have elapsed. Bending stress component induced by the solder stand-off height dominates the interface damage process. A straight interface crack front is predicted indicating the relatively brittle nature of the SAC405/Cu6Sn5 interface. The extended formulation of the CZM to account for load reversals has demonstrated the ability to describe the progressive solder/IMC interface damage process consistent with the mechanics of relatively brittle interface fracture.
format	Conference or Workshop Item
author	Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N.
author_facet	Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N.
author_sort	Yamin, A.F.M.
title	Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
title_short	Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
title_full	Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
title_fullStr	Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
title_full_unstemmed	Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
title_sort	extended cohesive zone model for simulation of solder/imc interface cyclic damage process in pb-free solder interconnects
publishDate	2012
url	http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/1/IEMT_2012.pdf
first_indexed	2023-09-18T20:56:05Z
last_indexed	2023-09-18T20:56:05Z
_version_	1777410313339011072

Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

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