Damage mechanics model for solder/intermetallics interface fracture process in solder joints

Damage mechanics model for solder/intermetallics interface fracture process in solder joints

The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fract...

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Main Authors: Shaffiar, Norhashimah, Laib, Z. B., Tam, M. N.
Format: Article
Language:English
Published: Trans Tech Publications, Switzerland 2011
Subjects:
TA349 Mechanics of engineering. Applied mechanics
Online Access:http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/1/KEM.462-463.1409_2011_Damage_Mechanics_Model_for_Solder-Intermetallics_Interface_Fracture_Process_in_Solder_Joints.pdf
id iium-39037
recordtype eprints
spelling iium-390372014-11-25T06:23:41Z http://irep.iium.edu.my/39037/ Damage mechanics model for solder/intermetallics interface fracture process in solder joints Shaffiar, Norhashimah Laib, Z. B. Tam, M. N. TA349 Mechanics of engineering. Applied mechanics The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fracture event. Reflowed Sn-4Ag-0.5Cu (SAC405) solder ball on OSP copper pad and orthotropic FR4 substrate under ball shear push test condition at 3000 mm/sec is simulated. Unified inelastic strain constitutive model describes the strain rate-response of the SAC405 solder. Comparable simulated and measured load-displacement values during solder ball shear push test serve as validation of the damage-based FE model. Results indicate a nonlinear damage evolution at each material point of the solder/IMC interface during the ball shear push test. The normal-to-shear traction ratio at the onset of the interface fracture is 1.59 indicating significant induced bending effect due to shear tool clearance. Rapid interface crack propagation is predicted following crack initiation event with the average crack speed up to 24.6 times the applied shear tool speed. The high stress concentration along the edge of the solder/IMC interface facilitates local crack initiation and dictates the shape of the predicted dynamic crack front. Trans Tech Publications, Switzerland 2011 Article PeerReviewed application/pdf en http://irep.iium.edu.my/39037/1/KEM.462-463.1409_2011_Damage_Mechanics_Model_for_Solder-Intermetallics_Interface_Fracture_Process_in_Solder_Joints.pdf Shaffiar, Norhashimah and Laib, Z. B. and Tam, M. N. (2011) Damage mechanics model for solder/intermetallics interface fracture process in solder joints. Key Engineering Materials, 462-63. pp. 1409-1414. ISSN 1013-9826 161.139.195.236-14/12/10,08:46:21
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
topic TA349 Mechanics of engineering. Applied mechanics
spellingShingle TA349 Mechanics of engineering. Applied mechanics
Shaffiar, Norhashimah
Laib, Z. B.
Tam, M. N.
Damage mechanics model for solder/intermetallics interface fracture process in solder joints
description The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fracture event. Reflowed Sn-4Ag-0.5Cu (SAC405) solder ball on OSP copper pad and orthotropic FR4 substrate under ball shear push test condition at 3000 mm/sec is simulated. Unified inelastic strain constitutive model describes the strain rate-response of the SAC405 solder. Comparable simulated and measured load-displacement values during solder ball shear push test serve as validation of the damage-based FE model. Results indicate a nonlinear damage evolution at each material point of the solder/IMC interface during the ball shear push test. The normal-to-shear traction ratio at the onset of the interface fracture is 1.59 indicating significant induced bending effect due to shear tool clearance. Rapid interface crack propagation is predicted following crack initiation event with the average crack speed up to 24.6 times the applied shear tool speed. The high stress concentration along the edge of the solder/IMC interface facilitates local crack initiation and dictates the shape of the predicted dynamic crack front.
format Article
author Shaffiar, Norhashimah
Laib, Z. B.
Tam, M. N.
author_facet Shaffiar, Norhashimah
Laib, Z. B.
Tam, M. N.
author_sort Shaffiar, Norhashimah
title Damage mechanics model for solder/intermetallics interface fracture process in solder joints
title_short Damage mechanics model for solder/intermetallics interface fracture process in solder joints
title_full Damage mechanics model for solder/intermetallics interface fracture process in solder joints
title_fullStr Damage mechanics model for solder/intermetallics interface fracture process in solder joints
title_full_unstemmed Damage mechanics model for solder/intermetallics interface fracture process in solder joints
title_sort damage mechanics model for solder/intermetallics interface fracture process in solder joints
publisher Trans Tech Publications, Switzerland
publishDate 2011
url http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/1/KEM.462-463.1409_2011_Damage_Mechanics_Model_for_Solder-Intermetallics_Interface_Fracture_Process_in_Solder_Joints.pdf
first_indexed 2023-09-18T20:56:04Z
last_indexed 2023-09-18T20:56:04Z
_version_ 1777410312148877312

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