Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating

Micro-Wire Electro-discharge machining (-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. -WEDM process is difficult to be ap...

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Main Authors:	Rasheed, Aous Naji, Abdul Muthalif, Asan Gani, Saleh, Tanveer
Format:	Article
Language:	English
Published:	Nova Science Publisher 2014
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://irep.iium.edu.my/37120/ http://irep.iium.edu.my/37120/ http://irep.iium.edu.my/37120/1/Vol5_1-2_JMTR.pdf

id	iium-37120
recordtype	eprints
spelling	iium-371202014-07-02T02:14:42Z http://irep.iium.edu.my/37120/ Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer TJ Mechanical engineering and machinery Micro-Wire Electro-discharge machining (-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. -WEDM process is difficult to be applied for semiconductor material like Silicon (Si). In this paper a new approach is proposed for machining polished Si (p-type, resistivity 1-50 -cm) wafer. In this method initially Si workpiece is coated with a conductive material (gold for this study) and then -WEDM operation is carried out. Finally after WEDM operation the conductive layer is removed from the polished Si substrate without damaging the substrate. WEDM process stability was found to be improved (up to 60 times for certain machining condition) if coated Si wafer is used as compared to uncoated Si workpiece. Material removal rate was also found to be increased by a good margin (~ 100% maximum) for coated Si wafer. Machined slots were found to be more uniform though kerf width was slightly larger for coated Si wafer. Overall this new method of -WEDM operation of polished Si wafer has been found to be more efficient and useful. Nova Science Publisher 2014 Article PeerReviewed application/pdf en http://irep.iium.edu.my/37120/1/Vol5_1-2_JMTR.pdf Rasheed, Aous Naji and Abdul Muthalif, Asan Gani and Saleh, Tanveer (2014) Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating. Journal of Manufacturing Technology Research, 5 (1-2). pp. 1-17. ISSN 1943-8095 https://www.novapublishers.com/catalog/product_info.php?products_id=47675
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
description	Micro-Wire Electro-discharge machining (-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. -WEDM process is difficult to be applied for semiconductor material like Silicon (Si). In this paper a new approach is proposed for machining polished Si (p-type, resistivity 1-50 -cm) wafer. In this method initially Si workpiece is coated with a conductive material (gold for this study) and then -WEDM operation is carried out. Finally after WEDM operation the conductive layer is removed from the polished Si substrate without damaging the substrate. WEDM process stability was found to be improved (up to 60 times for certain machining condition) if coated Si wafer is used as compared to uncoated Si workpiece. Material removal rate was also found to be increased by a good margin (~ 100% maximum) for coated Si wafer. Machined slots were found to be more uniform though kerf width was slightly larger for coated Si wafer. Overall this new method of -WEDM operation of polished Si wafer has been found to be more efficient and useful.
format	Article
author	Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer
author_facet	Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer
author_sort	Rasheed, Aous Naji
title	Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
title_short	Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
title_full	Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
title_fullStr	Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
title_full_unstemmed	Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
title_sort	enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
publisher	Nova Science Publisher
publishDate	2014
url	http://irep.iium.edu.my/37120/ http://irep.iium.edu.my/37120/ http://irep.iium.edu.my/37120/1/Vol5_1-2_JMTR.pdf
first_indexed	2023-09-18T20:53:14Z
last_indexed	2023-09-18T20:53:14Z
_version_	1777410134074458112

Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating

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