Development of a high hertz-stress contact for conventional batch production using a unique scribing technology

Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm du...

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Main Authors: Bhuiyan, Moinul, Alamgir, Tarik Bin, Bhuiyan, Munira, Kajihara, Masanori
Format: Article
Language:English
Published: IOP Publishing 2013
Subjects:
Online Access:http://irep.iium.edu.my/34442/
http://irep.iium.edu.my/34442/
http://irep.iium.edu.my/34442/
http://irep.iium.edu.my/34442/1/Development_of_a_high_hertz-stress_contact_for_conventional_batch_production_using_a_unique_scribing_technology.pdf
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recordtype eprints
spelling iium-344422014-07-03T07:40:31Z http://irep.iium.edu.my/34442/ Development of a high hertz-stress contact for conventional batch production using a unique scribing technology Bhuiyan, Moinul Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori TA401 Materials of engineering and construction Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ. IOP Publishing 2013 Article PeerReviewed application/pdf en http://irep.iium.edu.my/34442/1/Development_of_a_high_hertz-stress_contact_for_conventional_batch_production_using_a_unique_scribing_technology.pdf Bhuiyan, Moinul and Alamgir, Tarik Bin and Bhuiyan, Munira and Kajihara, Masanori (2013) Development of a high hertz-stress contact for conventional batch production using a unique scribing technology. IOP Conference Series: Materials Science and Engineering, 53 (012068). ISSN 1757-8981 http://iopscience.iop.org/1757-899X/53/1/012068 doi:10.1088/1757-899X/53/1/012068
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
topic TA401 Materials of engineering and construction
spellingShingle TA401 Materials of engineering and construction
Bhuiyan, Moinul
Alamgir, Tarik Bin
Bhuiyan, Munira
Kajihara, Masanori
Development of a high hertz-stress contact for conventional batch production using a unique scribing technology
description Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ.
format Article
author Bhuiyan, Moinul
Alamgir, Tarik Bin
Bhuiyan, Munira
Kajihara, Masanori
author_facet Bhuiyan, Moinul
Alamgir, Tarik Bin
Bhuiyan, Munira
Kajihara, Masanori
author_sort Bhuiyan, Moinul
title Development of a high hertz-stress contact for conventional batch production using a unique scribing technology
title_short Development of a high hertz-stress contact for conventional batch production using a unique scribing technology
title_full Development of a high hertz-stress contact for conventional batch production using a unique scribing technology
title_fullStr Development of a high hertz-stress contact for conventional batch production using a unique scribing technology
title_full_unstemmed Development of a high hertz-stress contact for conventional batch production using a unique scribing technology
title_sort development of a high hertz-stress contact for conventional batch production using a unique scribing technology
publisher IOP Publishing
publishDate 2013
url http://irep.iium.edu.my/34442/
http://irep.iium.edu.my/34442/
http://irep.iium.edu.my/34442/
http://irep.iium.edu.my/34442/1/Development_of_a_high_hertz-stress_contact_for_conventional_batch_production_using_a_unique_scribing_technology.pdf
first_indexed 2023-09-18T20:49:38Z
last_indexed 2023-09-18T20:49:38Z
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