MEMS and EFF Technology based micro connector for future miniature devices

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower...

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Main Authors:	Bhuiyan, Md. Moinul Islam, Rashid, Muhammad Mahbubur, Alamgir, Tarik Bin, Bhuiyan, Munira, Kajihara, Masanori
Format:	Conference or Workshop Item
Language:	English English
Published:	2013
Subjects:	TA165 Engineering instruments, meters, etc. Industrial instrumentation
Online Access:	http://irep.iium.edu.my/33343/ http://irep.iium.edu.my/33343/ http://irep.iium.edu.my/33343/1/2129_MEMS_and_EFF_Technology_based_Micro_Connector_for.pdf http://irep.iium.edu.my/33343/2/ICOM13_Programme_Book.pdf

id	iium-33343
recordtype	eprints
spelling	iium-333432013-12-13T07:25:33Z http://irep.iium.edu.my/33343/ MEMS and EFF Technology based micro connector for future miniature devices Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori TA165 Engineering instruments, meters, etc. Industrial instrumentation The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique. 2013-07-02 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/33343/1/2129_MEMS_and_EFF_Technology_based_Micro_Connector_for.pdf application/pdf en http://irep.iium.edu.my/33343/2/ICOM13_Programme_Book.pdf Bhuiyan, Md. Moinul Islam and Rashid, Muhammad Mahbubur and Alamgir, Tarik Bin and Bhuiyan, Munira and Kajihara, Masanori (2013) MEMS and EFF Technology based micro connector for future miniature devices. In: IIUM Engineering Congress 2013 (ICOM '13), 2-4 Jul 2013, Berjaya Times Square Hotel, Kuala Lumpur. (Unpublished) http://www.iium.edu.my/icom2013/13/
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English English
topic	TA165 Engineering instruments, meters, etc. Industrial instrumentation
spellingShingle	TA165 Engineering instruments, meters, etc. Industrial instrumentation Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori MEMS and EFF Technology based micro connector for future miniature devices
description	The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique.
format	Conference or Workshop Item
author	Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori
author_facet	Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori
author_sort	Bhuiyan, Md. Moinul Islam
title	MEMS and EFF Technology based micro connector for future miniature devices
title_short	MEMS and EFF Technology based micro connector for future miniature devices
title_full	MEMS and EFF Technology based micro connector for future miniature devices
title_fullStr	MEMS and EFF Technology based micro connector for future miniature devices
title_full_unstemmed	MEMS and EFF Technology based micro connector for future miniature devices
title_sort	mems and eff technology based micro connector for future miniature devices
publishDate	2013
url	http://irep.iium.edu.my/33343/ http://irep.iium.edu.my/33343/ http://irep.iium.edu.my/33343/1/2129_MEMS_and_EFF_Technology_based_Micro_Connector_for.pdf http://irep.iium.edu.my/33343/2/ICOM13_Programme_Book.pdf
first_indexed	2023-09-18T20:48:11Z
last_indexed	2023-09-18T20:48:11Z
_version_	1777409816264704000

MEMS and EFF Technology based micro connector for future miniature devices

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