Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology

Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm du...

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Main Authors: Bhuiyan, Md. Moinul Islam, Rashid, Muhammad Mahbubur, Alamgir, Tarik, Bhuiyan, Munira, Kajihara, Masanori
Format: Conference or Workshop Item
Language:English
English
Published: 2013
Subjects:
Online Access:http://irep.iium.edu.my/33339/
http://irep.iium.edu.my/33339/
http://irep.iium.edu.my/33339/1/2137_Development_of_a_High_Hertz-Stress_Contact_for_Conventional.pdf
http://irep.iium.edu.my/33339/4/ICOM13_Programme_Book.pdf
id iium-33339
recordtype eprints
spelling iium-333392013-12-13T07:42:28Z http://irep.iium.edu.my/33339/ Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori TA174 Engineering design Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ. 2013-07-02 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/33339/1/2137_Development_of_a_High_Hertz-Stress_Contact_for_Conventional.pdf application/pdf en http://irep.iium.edu.my/33339/4/ICOM13_Programme_Book.pdf Bhuiyan, Md. Moinul Islam and Rashid, Muhammad Mahbubur and Alamgir, Tarik and Bhuiyan, Munira and Kajihara, Masanori (2013) Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology. In: IIUM Engineering Congress 2013 (ICOM '13), 2-4 Jul 2013, Berjaya Times Square Hotel, Kuala Lumpur. (Unpublished) http://www.iium.edu.my/icom2013/13/
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
English
topic TA174 Engineering design
spellingShingle TA174 Engineering design
Bhuiyan, Md. Moinul Islam
Rashid, Muhammad Mahbubur
Alamgir, Tarik
Bhuiyan, Munira
Kajihara, Masanori
Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology
description Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ.
format Conference or Workshop Item
author Bhuiyan, Md. Moinul Islam
Rashid, Muhammad Mahbubur
Alamgir, Tarik
Bhuiyan, Munira
Kajihara, Masanori
author_facet Bhuiyan, Md. Moinul Islam
Rashid, Muhammad Mahbubur
Alamgir, Tarik
Bhuiyan, Munira
Kajihara, Masanori
author_sort Bhuiyan, Md. Moinul Islam
title Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology
title_short Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology
title_full Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology
title_fullStr Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology
title_full_unstemmed Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology
title_sort development of a high hertz-stress contact for conventional batch production using a unique scribing technology
publishDate 2013
url http://irep.iium.edu.my/33339/
http://irep.iium.edu.my/33339/
http://irep.iium.edu.my/33339/1/2137_Development_of_a_High_Hertz-Stress_Contact_for_Conventional.pdf
http://irep.iium.edu.my/33339/4/ICOM13_Programme_Book.pdf
first_indexed 2023-09-18T20:48:11Z
last_indexed 2023-09-18T20:48:11Z
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