Development and optimization of High-Hertz stress contact to reduce future contact material cost

Development and optimization of High-Hertz stress contact to reduce future contact material cost

Reducing a total contact material cost of a connector, a high-Hertz stress with low normal force (LNF) contact will be a key technology in the future. Only an R5m tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional connectors. 0.30 millio...

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Bibliographic Details
Main Author: Bhuiyan, Moinul
Format: Conference or Workshop Item
Language:English
English
Published: 2010
Subjects:
TA401 Materials of engineering and construction
Online Access:http://irep.iium.edu.my/33189/
http://irep.iium.edu.my/33189/
http://irep.iium.edu.my/33189/1/Development_and_Optimization_of_High-Hertz_Stress_Contact_to_Reduce_Future_Contact_Material_Cost.pdf
http://irep.iium.edu.my/33189/4/TE_Technical_Conference_2010.jpg
id iium-33189
recordtype eprints
spelling iium-331892013-12-20T07:21:21Z http://irep.iium.edu.my/33189/ Development and optimization of High-Hertz stress contact to reduce future contact material cost Bhuiyan, Moinul TA401 Materials of engineering and construction Reducing a total contact material cost of a connector, a high-Hertz stress with low normal force (LNF) contact will be a key technology in the future. Only an R5m tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional connectors. 0.30 million cycles durability test was passed and the contact resistance was ≦50m-ohm. 2010-10-20 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/33189/1/Development_and_Optimization_of_High-Hertz_Stress_Contact_to_Reduce_Future_Contact_Material_Cost.pdf application/pdf en http://irep.iium.edu.my/33189/4/TE_Technical_Conference_2010.jpg Bhuiyan, Moinul (2010) Development and optimization of High-Hertz stress contact to reduce future contact material cost. In: Tyco Electronics Technical Conference 2010, 18-20 October 2010, San Jose, USA. (Unpublished) http://www.te.com/en/home.html
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
English
topic TA401 Materials of engineering and construction
spellingShingle TA401 Materials of engineering and construction
Bhuiyan, Moinul
Development and optimization of High-Hertz stress contact to reduce future contact material cost
description Reducing a total contact material cost of a connector, a high-Hertz stress with low normal force (LNF) contact will be a key technology in the future. Only an R5m tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional connectors. 0.30 million cycles durability test was passed and the contact resistance was ≦50m-ohm.
format Conference or Workshop Item
author Bhuiyan, Moinul
author_facet Bhuiyan, Moinul
author_sort Bhuiyan, Moinul
title Development and optimization of High-Hertz stress contact to reduce future contact material cost
title_short Development and optimization of High-Hertz stress contact to reduce future contact material cost
title_full Development and optimization of High-Hertz stress contact to reduce future contact material cost
title_fullStr Development and optimization of High-Hertz stress contact to reduce future contact material cost
title_full_unstemmed Development and optimization of High-Hertz stress contact to reduce future contact material cost
title_sort development and optimization of high-hertz stress contact to reduce future contact material cost
publishDate 2010
url http://irep.iium.edu.my/33189/
http://irep.iium.edu.my/33189/
http://irep.iium.edu.my/33189/1/Development_and_Optimization_of_High-Hertz_Stress_Contact_to_Reduce_Future_Contact_Material_Cost.pdf
http://irep.iium.edu.my/33189/4/TE_Technical_Conference_2010.jpg
first_indexed 2023-09-18T20:47:57Z
last_indexed 2023-09-18T20:47:57Z
_version_ 1777409801652797440

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