Micro connector fabricated by micro process technology
A fork - type micro connector with high aspect ratio and high - package density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB - 138N) was used as a mold of Ni electroforming. The tips of plug terminal of the micro connector were formed as movable po...
| Main Authors: | , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2000
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/33182/ http://irep.iium.edu.my/33182/ http://irep.iium.edu.my/33182/1/Micro_Connector_Fabricated_by_Micro_Process_Technology.pdf |
| Summary: | A fork - type micro connector with high aspect ratio and high -
package density was fabricated using UV thick photoresist and Ni
electroforming. A negative photoresist (THB - 138N) was used as a
mold of Ni electroforming. The tips of plug terminal of the micro
connector were formed as movable portions using Cu sacrificial layer
etching. In order to make iinn contact and precise connection of the
micro connector, two-step guidance was adopted. The size of the
tenninal of fabricated micro connector was 50 p - thickness and 15
pm - width (minimum). The maximum aspect ratio of the fabricated
micro connector is 3.3 and the terminal pitch is 80 pn. A contact
?&stance of approximately 50 & was obtained by using four - point
probe method. |
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