Micro connector for high packaging density fabricated by using UV Thick Photoresist

A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold of Ni electroforming. The tips of socket terminal of the micro connector were formed as movable portions...

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Main Authors:	Unno, Toshinori, Toriyama, Toshiyuki, Bhuiyan, Moinul, Yokoyama, Yoshihiko, Sugiyama, Susumu
Format:	Article
Language:	English
Published:	Institute of Electrical Engineers of Japan 2002
Subjects:	TA401 Materials of engineering and construction
Online Access:	http://irep.iium.edu.my/33179/ http://irep.iium.edu.my/33179/ http://irep.iium.edu.my/33179/1/Micro_Connector_for_High_Packaging_Density_Fabricated_by_Using_UV_Thick_Photoresist.pdf

id	iium-33179
recordtype	eprints
spelling	iium-331792014-07-03T07:53:45Z http://irep.iium.edu.my/33179/ Micro connector for high packaging density fabricated by using UV Thick Photoresist Unno, Toshinori Toriyama, Toshiyuki Bhuiyan, Moinul Yokoyama, Yoshihiko Sugiyama, Susumu TA401 Materials of engineering and construction A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold of Ni electroforming. The tips of socket terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make firm contact of the micro connector, two-step guidance was adopted. The size of the terminal of fabricated micro connector was 50 mm- thickness and 15 mm-width (minimum). The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80 mm. Figure 1 shows SEM photograph of the socket terminal which was formed by the Ni electroforming. A contact resistance of a 50 mW,a contact force of 2.08mN,Young痴 modulus of 80 GPa and a permissible current of 400 mA (single pair of the plug and socket terminals) were obtained practicl use for the micro connector. Institute of Electrical Engineers of Japan 2002-05 Article PeerReviewed application/pdf en http://irep.iium.edu.my/33179/1/Micro_Connector_for_High_Packaging_Density_Fabricated_by_Using_UV_Thick_Photoresist.pdf Unno, Toshinori and Toriyama, Toshiyuki and Bhuiyan, Moinul and Yokoyama, Yoshihiko and Sugiyama, Susumu (2002) Micro connector for high packaging density fabricated by using UV Thick Photoresist. Denki Gakkai Ronbunshi. E, Sensa, Maikuromashin Bumonshi / IEEJ Transactions on Sensors and Micromachines , 5 (122). pp. 249-255. ISSN 1341-8939 http://iss.ndl.go.jp/books/R000000004-I6152603-00
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA401 Materials of engineering and construction
spellingShingle	TA401 Materials of engineering and construction Unno, Toshinori Toriyama, Toshiyuki Bhuiyan, Moinul Yokoyama, Yoshihiko Sugiyama, Susumu Micro connector for high packaging density fabricated by using UV Thick Photoresist
description	A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold of Ni electroforming. The tips of socket terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make firm contact of the micro connector, two-step guidance was adopted. The size of the terminal of fabricated micro connector was 50 mm- thickness and 15 mm-width (minimum). The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80 mm. Figure 1 shows SEM photograph of the socket terminal which was formed by the Ni electroforming. A contact resistance of a 50 mW,a contact force of 2.08mN,Young痴 modulus of 80 GPa and a permissible current of 400 mA (single pair of the plug and socket terminals) were obtained practicl use for the micro connector.
format	Article
author	Unno, Toshinori Toriyama, Toshiyuki Bhuiyan, Moinul Yokoyama, Yoshihiko Sugiyama, Susumu
author_facet	Unno, Toshinori Toriyama, Toshiyuki Bhuiyan, Moinul Yokoyama, Yoshihiko Sugiyama, Susumu
author_sort	Unno, Toshinori
title	Micro connector for high packaging density fabricated by using UV Thick Photoresist
title_short	Micro connector for high packaging density fabricated by using UV Thick Photoresist
title_full	Micro connector for high packaging density fabricated by using UV Thick Photoresist
title_fullStr	Micro connector for high packaging density fabricated by using UV Thick Photoresist
title_full_unstemmed	Micro connector for high packaging density fabricated by using UV Thick Photoresist
title_sort	micro connector for high packaging density fabricated by using uv thick photoresist
publisher	Institute of Electrical Engineers of Japan
publishDate	2002
url	http://irep.iium.edu.my/33179/ http://irep.iium.edu.my/33179/ http://irep.iium.edu.my/33179/1/Micro_Connector_for_High_Packaging_Density_Fabricated_by_Using_UV_Thick_Photoresist.pdf
first_indexed	2023-09-18T20:47:56Z
last_indexed	2023-09-18T20:47:56Z
_version_	1777409800497266688

Micro connector for high packaging density fabricated by using UV Thick Photoresist

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