Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method

Silicon being a typical hard-brittle material is difficult to machine to a good surface finish. Although ductile-mode machining (DMM) is often employed to machine this advanced material but this technique requires the use of expensive ultra-precision machine tools therefore limiting its applicabili...

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Main Authors:	Abdur-Rasheed, Alao, Konneh, Mohamed
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2011
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://irep.iium.edu.my/3042/ http://irep.iium.edu.my/3042/ http://irep.iium.edu.my/3042/1/Optimization_of_precision_grinding.pdf

id	iium-3042
recordtype	eprints
spelling	iium-30422013-06-27T08:10:02Z http://irep.iium.edu.my/3042/ Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method Abdur-Rasheed, Alao Konneh, Mohamed TJ Mechanical engineering and machinery Silicon being a typical hard-brittle material is difficult to machine to a good surface finish. Although ductile-mode machining (DMM) is often employed to machine this advanced material but this technique requires the use of expensive ultra-precision machine tools therefore limiting its applicability. However, by proper selection of grinding parameters, precision grinding which can be performed on conventional machine tools can be used to generate massive ductile surfaces thereby reducing the polishing time and improving the surface quality. Precision grinding should be planned with reliability in advance and the process has to be performed with high rates of reproducibility. Therefore, this study investigated the effect and optimization of grinding parameters using Taguchi optimization technique during precision grinding of silicon. Experimental studies were conducted under varying depths of cut, feed rates and spindle speeds. An orthogonal array (OA), signal-to-noise (S/N) ratio and the analysis of variance (ANOVA) were employed to find the minimum surface roughness value and to analyze the effect of the grinding parameters on the surface roughness. Confirmation tests were carried out in order to illustrate the effectiveness of the Taguchi method. The results show that feed rate mostly affected the surface roughness. The predicted roughness (Ra) of 34 nm was in agreement with the confirmation tests. Massive ductilestreaked surface was also found corresponding to the minimal surface finish determined from the optimal levels. Trans Tech Publications, Switzerland 2011-06-30 Article PeerReviewed application/pdf en http://irep.iium.edu.my/3042/1/Optimization_of_precision_grinding.pdf Abdur-Rasheed, Alao and Konneh, Mohamed (2011) Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method. Advanced Materials Research, 264 . pp. 997-1002. ISSN 1022-6680 doi:10.4028/www.scientific.net/AMR.264-265.997
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Abdur-Rasheed, Alao Konneh, Mohamed Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method
description	Silicon being a typical hard-brittle material is difficult to machine to a good surface finish. Although ductile-mode machining (DMM) is often employed to machine this advanced material but this technique requires the use of expensive ultra-precision machine tools therefore limiting its applicability. However, by proper selection of grinding parameters, precision grinding which can be performed on conventional machine tools can be used to generate massive ductile surfaces thereby reducing the polishing time and improving the surface quality. Precision grinding should be planned with reliability in advance and the process has to be performed with high rates of reproducibility. Therefore, this study investigated the effect and optimization of grinding parameters using Taguchi optimization technique during precision grinding of silicon. Experimental studies were conducted under varying depths of cut, feed rates and spindle speeds. An orthogonal array (OA), signal-to-noise (S/N) ratio and the analysis of variance (ANOVA) were employed to find the minimum surface roughness value and to analyze the effect of the grinding parameters on the surface roughness. Confirmation tests were carried out in order to illustrate the effectiveness of the Taguchi method. The results show that feed rate mostly affected the surface roughness. The predicted roughness (Ra) of 34 nm was in agreement with the confirmation tests. Massive ductilestreaked surface was also found corresponding to the minimal surface finish determined from the optimal levels.
format	Article
author	Abdur-Rasheed, Alao Konneh, Mohamed
author_facet	Abdur-Rasheed, Alao Konneh, Mohamed
author_sort	Abdur-Rasheed, Alao
title	Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method
title_short	Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method
title_full	Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method
title_fullStr	Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method
title_full_unstemmed	Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method
title_sort	optimization of precision grinding parameters of silicon for surface roughness based on taguchi method
publisher	Trans Tech Publications, Switzerland
publishDate	2011
url	http://irep.iium.edu.my/3042/ http://irep.iium.edu.my/3042/ http://irep.iium.edu.my/3042/1/Optimization_of_precision_grinding.pdf
first_indexed	2023-09-18T20:10:44Z
last_indexed	2023-09-18T20:10:44Z
_version_	1777407460264378368

Optimization of precision grinding parameters of silicon for surface roughness based on taguchi method

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