High speed end milling of single crystal silicon using diamond coated tools

Brittle materials are hard to machine while maintaining the surface roughness desired. A brittle material will have little tendency to deform before it fractures when it is subjected to stress. Brittle material is also consider as a material which fails in tension rather than shear and has little...

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Main Authors:	Amin, A. K. M. Nurul, Dali, Mohd Hasani, Mahmud, Md. Asif
Format:	Book Chapter
Language:	English
Published:	IIUM Press 2011
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://irep.iium.edu.my/23608/ http://irep.iium.edu.my/23608/ http://irep.iium.edu.my/23608/4/chp29.pdf

id	iium-23608
recordtype	eprints
spelling	iium-236082012-09-13T03:08:19Z http://irep.iium.edu.my/23608/ High speed end milling of single crystal silicon using diamond coated tools Amin, A. K. M. Nurul Dali, Mohd Hasani Mahmud, Md. Asif TJ Mechanical engineering and machinery Brittle materials are hard to machine while maintaining the surface roughness desired. A brittle material will have little tendency to deform before it fractures when it is subjected to stress. Brittle material is also consider as a material which fails in tension rather than shear and has little or no evidence of plastic deformation before it fails. Thimmaiah et al. [1] specified that brittle materials, silicon by their inherent properties, are difficult to machine while maintaining the desired surface roughness but J. Yan et al. [2] reviewed that silicon is a nominally brittle material that can be deformed plastically in machining, yielding ductile chips under the influence of high hydrostatic pressure. Mariayyah [3] , stated that under certain controlled conditions, it is possible to machine brittle materials in ductile regime so that material removal is by plastic deformation, leaving a damage free surface. Rusnaldy et al. [4] research on the cutting parameters effect. They study about the effect of the depth of cut, feed rate and spindle speed. Rusnaldy et al. [5] showed that the dominant ductile cutting mode was achieved for Ft/Fc>1.0, which indicates that the thrust force is dominant over the cutting force. Cutting to a very small uncut chip thickness can cause ploughing, resulting in a poor surface due to high friction. Siva [6] proposes a predictive model to determine the undeformed chip thickness in micro-machining of single crystal brittle materials, where the mode of chip formation transitions from the ductile to the brittle regime. The proposed model would support the determination of the cutting conditions for the micromachining of a brittle material in ductile manner without resorting to trial and error. Furthermore, Sreejith [7] was able to obtain ductile mode of machining on silicon nitride by using Poly Crystalline Cubic Diamond (PCD) tools. His findings show that there is a maximum value of rake angle which will obtain ductile mode machining. Thimmaiah et al. [1] also did machining on silicon nitride but performed it using single point diamond turning. Their result indicates that small values of feed, small tooltip radius and at high speeds; conditions of pressure and temperature exist that facilitate ductile behaviour during machining. Negative rake angles are more likely to cause brittle to ductile transition when compared with the positive or zero degree rakes. These findings also correspond with Thimmaiah et al. [1] findings which also show that cutting force and thrust force increases as the rake angle becomes negative. The experimentation results differ with a crossover at between thrust force and cutting force at -45º.Furthermore, J. Yan et al (2000) stated that there is no inherent advantage in using rake angle more negative than -40º. IIUM Press 2011 Book Chapter PeerReviewed application/pdf en http://irep.iium.edu.my/23608/4/chp29.pdf Amin, A. K. M. Nurul and Dali, Mohd Hasani and Mahmud, Md. Asif (2011) High speed end milling of single crystal silicon using diamond coated tools. In: Advanced Machining Towards Improved Machinability of Difficult-to-Cut Materials. IIUM Press, Kuala Lumpur, Malaysia, pp. 217-223. ISBN 9789674181758 http://rms.research.iium.edu.my/bookstore/default.aspx
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Amin, A. K. M. Nurul Dali, Mohd Hasani Mahmud, Md. Asif High speed end milling of single crystal silicon using diamond coated tools
description	Brittle materials are hard to machine while maintaining the surface roughness desired. A brittle material will have little tendency to deform before it fractures when it is subjected to stress. Brittle material is also consider as a material which fails in tension rather than shear and has little or no evidence of plastic deformation before it fails. Thimmaiah et al. [1] specified that brittle materials, silicon by their inherent properties, are difficult to machine while maintaining the desired surface roughness but J. Yan et al. [2] reviewed that silicon is a nominally brittle material that can be deformed plastically in machining, yielding ductile chips under the influence of high hydrostatic pressure. Mariayyah [3] , stated that under certain controlled conditions, it is possible to machine brittle materials in ductile regime so that material removal is by plastic deformation, leaving a damage free surface. Rusnaldy et al. [4] research on the cutting parameters effect. They study about the effect of the depth of cut, feed rate and spindle speed. Rusnaldy et al. [5] showed that the dominant ductile cutting mode was achieved for Ft/Fc>1.0, which indicates that the thrust force is dominant over the cutting force. Cutting to a very small uncut chip thickness can cause ploughing, resulting in a poor surface due to high friction. Siva [6] proposes a predictive model to determine the undeformed chip thickness in micro-machining of single crystal brittle materials, where the mode of chip formation transitions from the ductile to the brittle regime. The proposed model would support the determination of the cutting conditions for the micromachining of a brittle material in ductile manner without resorting to trial and error. Furthermore, Sreejith [7] was able to obtain ductile mode of machining on silicon nitride by using Poly Crystalline Cubic Diamond (PCD) tools. His findings show that there is a maximum value of rake angle which will obtain ductile mode machining. Thimmaiah et al. [1] also did machining on silicon nitride but performed it using single point diamond turning. Their result indicates that small values of feed, small tooltip radius and at high speeds; conditions of pressure and temperature exist that facilitate ductile behaviour during machining. Negative rake angles are more likely to cause brittle to ductile transition when compared with the positive or zero degree rakes. These findings also correspond with Thimmaiah et al. [1] findings which also show that cutting force and thrust force increases as the rake angle becomes negative. The experimentation results differ with a crossover at between thrust force and cutting force at -45º.Furthermore, J. Yan et al (2000) stated that there is no inherent advantage in using rake angle more negative than -40º.
format	Book Chapter
author	Amin, A. K. M. Nurul Dali, Mohd Hasani Mahmud, Md. Asif
author_facet	Amin, A. K. M. Nurul Dali, Mohd Hasani Mahmud, Md. Asif
author_sort	Amin, A. K. M. Nurul
title	High speed end milling of single crystal silicon using diamond coated tools
title_short	High speed end milling of single crystal silicon using diamond coated tools
title_full	High speed end milling of single crystal silicon using diamond coated tools
title_fullStr	High speed end milling of single crystal silicon using diamond coated tools
title_full_unstemmed	High speed end milling of single crystal silicon using diamond coated tools
title_sort	high speed end milling of single crystal silicon using diamond coated tools
publisher	IIUM Press
publishDate	2011
url	http://irep.iium.edu.my/23608/ http://irep.iium.edu.my/23608/ http://irep.iium.edu.my/23608/4/chp29.pdf
first_indexed	2023-09-18T20:35:40Z
last_indexed	2023-09-18T20:35:40Z
_version_	1777409029305270272

High speed end milling of single crystal silicon using diamond coated tools

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