Influences of additives on copper film quality and gap filling capability of plating process
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Language: | English |
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IIUM Press
2011
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Online Access: | http://irep.iium.edu.my/19353/ http://irep.iium.edu.my/19353/ http://irep.iium.edu.my/19353/1/chp6.pdf |
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iium-193532012-09-05T00:19:04Z http://irep.iium.edu.my/19353/ Influences of additives on copper film quality and gap filling capability of plating process Mridha, Shahjahan Law, Shao Beng TJ Mechanical engineering and machinery IIUM Press 2011 Book Chapter PeerReviewed application/pdf en http://irep.iium.edu.my/19353/1/chp6.pdf Mridha, Shahjahan and Law, Shao Beng (2011) Influences of additives on copper film quality and gap filling capability of plating process. In: Contemporary metallic materials. IIUM Press, Kuala Lumpur, pp. 34-40. ISBN 9789674181642 http://rms.research.iium.edu.my/bookstore/default.aspx |
repository_type |
Digital Repository |
institution_category |
Local University |
institution |
International Islamic University Malaysia |
building |
IIUM Repository |
collection |
Online Access |
language |
English |
topic |
TJ Mechanical engineering and machinery |
spellingShingle |
TJ Mechanical engineering and machinery Mridha, Shahjahan Law, Shao Beng Influences of additives on copper film quality and gap filling capability of plating process |
format |
Book Chapter |
author |
Mridha, Shahjahan Law, Shao Beng |
author_facet |
Mridha, Shahjahan Law, Shao Beng |
author_sort |
Mridha, Shahjahan |
title |
Influences of additives on copper film quality and gap filling capability of plating process |
title_short |
Influences of additives on copper film quality and gap filling capability of plating process |
title_full |
Influences of additives on copper film quality and gap filling capability of plating process |
title_fullStr |
Influences of additives on copper film quality and gap filling capability of plating process |
title_full_unstemmed |
Influences of additives on copper film quality and gap filling capability of plating process |
title_sort |
influences of additives on copper film quality and gap filling capability of plating process |
publisher |
IIUM Press |
publishDate |
2011 |
url |
http://irep.iium.edu.my/19353/ http://irep.iium.edu.my/19353/ http://irep.iium.edu.my/19353/1/chp6.pdf |
first_indexed |
2023-09-18T20:28:54Z |
last_indexed |
2023-09-18T20:28:54Z |
_version_ |
1777408602794885120 |