Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study
Air-cooling characteristics of an electronic-device heat sink have been experimentally and numerically investigated under various operating conditions for air. Flowing air velocities of 0–7:1 m=s were circulated through a wind tunnel with a rectangular section. The lower surface of the wind tunnel w...
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American Institute of Aeronautics and Astronautics
2010
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| Online Access: | http://irep.iium.edu.my/1923/ http://irep.iium.edu.my/1923/ http://irep.iium.edu.my/1923/ http://irep.iium.edu.my/1923/2/165.pdf |
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iium-19232011-12-01T08:21:45Z http://irep.iium.edu.my/1923/ Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study Hrairi, Meftah Ahmed, Mirghani Ishak Ismail, Ahmad Faris TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Air-cooling characteristics of an electronic-device heat sink have been experimentally and numerically investigated under various operating conditions for air. Flowing air velocities of 0–7:1 m=s were circulated through a wind tunnel with a rectangular section. The lower surface of the wind tunnel was equipped with 5 by 3 heat sources subjected to uniform heat flux. From the experimental measurements, surface temperature distributions of the discrete heat sources were obtained and effects of Reynolds numbers on these temperatures were investigated. A computational fluid dynamics analysis of the cooling process was conducted to simulate the system and to calculate the required cooling rate. A relation was identified between the thermal-wake function and capability of the software to give better estimations of the circuit-board temperatures. Overall, the obtained results showed good agreement between the simulation and the experimental results. In particular, it was found that surface temperatures of heated modules decrease with increasing Reynolds number. American Institute of Aeronautics and Astronautics 2010-03 Article PeerReviewed application/pdf en http://irep.iium.edu.my/1923/2/165.pdf Hrairi, Meftah and Ahmed, Mirghani Ishak and Ismail, Ahmad Faris (2010) Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study. Journal of Thermophysics and Heat Transfer, 24 (1). pp. 165-172. ISSN 1533-6808 (O), 0887-8722 (P) http://www.aiaa.org/content.cfm?pageid=318&volume=24&issue=1&pubid=26&paperid=44154 DOI : 10.2514/1.44154 |
| repository_type |
Digital Repository |
| institution_category |
Local University |
| institution |
International Islamic University Malaysia |
| building |
IIUM Repository |
| collection |
Online Access |
| language |
English |
| topic |
TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics |
| spellingShingle |
TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Hrairi, Meftah Ahmed, Mirghani Ishak Ismail, Ahmad Faris Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study |
| description |
Air-cooling characteristics of an electronic-device heat sink have been experimentally and numerically investigated under various operating conditions for air. Flowing air velocities of 0–7:1 m=s were circulated through a wind tunnel with a rectangular section. The lower surface of the wind tunnel was equipped with 5 by 3 heat sources subjected to uniform heat flux. From the experimental measurements, surface temperature distributions of the discrete heat sources were obtained and effects of Reynolds numbers on these temperatures were investigated. A computational fluid dynamics analysis of the cooling process was conducted to simulate the system and to calculate the required cooling rate. A relation was identified between the thermal-wake function and capability of the software to give better estimations of the circuit-board temperatures. Overall, the obtained results showed good agreement between the simulation and the experimental results. In particular, it was found that surface temperatures of heated modules decrease with increasing Reynolds number. |
| format |
Article |
| author |
Hrairi, Meftah Ahmed, Mirghani Ishak Ismail, Ahmad Faris |
| author_facet |
Hrairi, Meftah Ahmed, Mirghani Ishak Ismail, Ahmad Faris |
| author_sort |
Hrairi, Meftah |
| title |
Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study |
| title_short |
Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study |
| title_full |
Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study |
| title_fullStr |
Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study |
| title_full_unstemmed |
Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study |
| title_sort |
mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study |
| publisher |
American Institute of Aeronautics and Astronautics |
| publishDate |
2010 |
| url |
http://irep.iium.edu.my/1923/ http://irep.iium.edu.my/1923/ http://irep.iium.edu.my/1923/ http://irep.iium.edu.my/1923/2/165.pdf |
| first_indexed |
2023-09-18T20:09:28Z |
| last_indexed |
2023-09-18T20:09:28Z |
| _version_ |
1777407380375470080 |