APA (7th ed.) Citation

Tong & Gosele. (1999). Semiconductor wafer bonding: Science and technology. John Wiley & Sons.

Chicago Style (17th ed.) Citation

Tong and Gosele. Semiconductor Wafer Bonding: Science and Technology. New York: John Wiley & Sons, 1999.

MLA (8th ed.) Citation

Tong and Gosele. Semiconductor Wafer Bonding: Science and Technology. John Wiley & Sons, 1999.

Warning: These citations may not always be 100% accurate.